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Speedline Launches OmniFlex™ 10 Reflow, VectraElite™ Wave Soldering Systems, Demonstrates Continuing Leadership in Lead-Free Solutions

21 November 2005

The launch of Speedline Technologies’ new Electrovert OmniFlex 10 Reflow Oven and Electrovert VectraElite Wave Soldering System at Productronica 2005 demonstrates the firm’s continuing leadership in providing innovative lead-free ready solutions to the SMT manufacturing and PCB assembly industries.

New OmniFlex 10 Reflow Oven

Designed to optimize operating efficiencies, reduce maintenance intervals, and lower life-cycle costs, the introduction of Speedline’s new Electrovert OmniFlex 10 Reflow Oven redefines the meaning of value leadership in the world of reflow soldering equipment.

Featuring advanced heating and cooling transfer technologies, energy efficient design concepts, and reduced maintenance requirements, the OmniFlex 10 is an integral solution for electronics manufacturers seeking to ease their lead-free conversion challenges.

With the OmniFlex 10, up to 50% less power and up to 35% less nitrogen is often required than comparable platforms available today – due to a host of new designs and features including standard, variable-speed closed-loop blower control, power limiting, balanced gas flow and an innovative dual chamber heating design.

Specifications for the OmniFlex 10 are: Process Width: 508 mm (20"); Heated Length: 3810 mm (148"); Cooling Length: 1285 mm (50.5"); and Maximum Operating Temperature: 350°C (662°F).

New VectraElite Wave Soldering System

Speedline’s Electrovert VectraElite wave soldering system features a host of improvements. Combined with Speedline’s new UltraFill nozzles and the upper High Velocity Convection pre-heat (HVC) module, the introduction of the ServoJet spray fluxer enables the new Vectra system to provide unmatched performance. The ServoJet spray fluxer, coupled with the Performa and Opti-Flux II, completes a spray fluxer product offering that cannot be matched. The new VectraElite couples the proven core subsystems of the performance leading Vectra, along with features designed to improve system wide access, a new roll-out solder pot design, and additional numerous enhancements throughout.

The new OmniFlex 10 Reflow Oven and the new VectraElite Wave Soldering System are available immediately. For more information, contact your Speedline distributor or representative. Reach Speedline Technologies directly at +49 (0)6103/832-0, or on the Internet at: http://www.speedlinetech.com.

About Speedline Technologies
Speedline Technologies is the global leader in process knowledge and expertise for the PCB assembly and semiconductor industries. Based in Franklin, Massachusetts, U.S.A., the company markets five best-in-class brands — Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support, and training solutions. Speedline Technologies is Frost & Sullivan’s “2005 Surface Mount Technology Company of the Year.” For more information, visit: http://www.speedlinetech.com or contact Speedline at:
* USA: Speedline Technologies, 16 Forge Park, Franklin, MA 02038 USA, Tel: 1-508-520-0083, Fax: 1-508-520-2288, E-mail: e-mail protected from spam bots;
* Europe: Speedline Technologies GmbH, Im Gefierth 14, 63303 Dreieich, Germany, Tel: +49 (0)6103/832-0, Fax: +49(0)6103/832-299, E-mail: e-mail protected from spam bots;
* Asia: Speedline Technologies Asia Pte Ltd, 150 Kampong Ampat, #05-08 KA Centre, Singapore 368324, Tel: 65-6286-6635, Fax: 65-6289-9411, E-mail: e-mail protected from spam bots.


Source: PR Web


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